Aremco-Bond 517 is a 2-component adhesive with high thermal conductivity.
The thermal expansion coefficient, which is close to that of copper and aluminum, combined with excellent dielectric properties, distinguishes this adhesive.
Often used in controllable silicon cell, power transistor and circuit applications.
- Working temperature -20 ° C to 150 ° C
- Item number: 115517 ..
Available in different packagingTDS Aremco-Bond 517