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Aremco-Bond 517

Thermal conductive adhesive

Aremco-Bond 517 is a 2-component adhesive with high thermal conductivity.

The thermal expansion coefficient, which is close to that of copper and aluminum, combined with excellent dielectric properties, distinguishes this adhesive. Often used in controllable silicon cell, power transistor and circuit applications.

  • Working temperature -20 °C to 150 °C
  • Item No.: 115517..

 Available in different packaging

TDS Aremco-Bond 517
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