Aremco-Bond 556 is a silver-filled 2-component adhesive with good electrical conductivity. This adhesive is solvent-free and cures chemically at room temperature. It is ideal for bonding chips, attaching heat-sensitive parts or bonding grounding lines where soldering is not an option.

• Temperature resistant up to 170 °C
• Base: epoxy resin
• Item No.: 115556..

Available in different versions